Slitagemekanism för diamantverktyg
Släpptid:
2022-05-17
Slitagemekanismerna för diamantverktyg är följande: friktionsslitage, kornbrott, bindningsbrott, nötningsslitage, ytutmattning och slag, friktionsslitage gör kornet trubbigt och slätt

The wear mechanisms of diamond tools are as follows: friction wear, grain breakage, bond breakage, abrasion wear, surface fatigue and impact, friction wear makes grain blunt and smooth, bond breakage makes grain fall off, the abrasive wear reduces the strength of the BINDER and promotes the abscission of abrasive grains. The wear mechanism is different in different machining processes.
The wear of diamond tools consists of three stages: the initial rapid wear stage (also called the transition stage) , the stable wear stage with the wear rate about constant and the accelerated wear stage. The accelerated wear phase indicates that the tool is not working and needs to be recalibrated. The main diamond tools for machining hard and brittle materials are various diamond saws and diamond grinding wheels. Although the application scope and machining characteristics of these tools are different, their wear mechanisms are basically the same. Because the wear of diamond tools has a great influence on the machining quality and process of the workpiece, the wear performance of the tools is an important index reflecting the rationality of the tool performance and process parameters, therefore, the research on the wear mechanism of diamond tools can guide the rational manufacturing and technological parameters of diamond tools.
So far, a lot of research has been done on the sawing mechanism of hard and brittle materials such as stone with diamond tools and the wear mechanism of diamond tools. However, due to the complexity of the sawing process, most of these studies are in the exploratory stage, there are many important theoretical problems, such as the micro-mechanism of sawing process, the theoretical calculation of Sawing Force, the micro-wear mechanism of diamond grits, the analysis of micro-interface between diamond grits and sintered matrix or electroplated layer, etc.
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